December 3–6, 2024 – Singapore
We are pleased to share that the M3NIR project was presented at the IEEE Electronics Packaging Technology Conference (EPTC) 2024), held in Singapore from December 3–6, 2024. The EPTC is one of the flagship international conferences in electronic packaging, bringing together experts from industry and academia to discuss the latest advances in microelectronics, integration technologies, and system-level innovation.
Our partner imec delivered a presentation featuring M3NIR results, highlighting progress in developing advanced mid-IR and near-IR photonic sensing components and their potential integration into compact diagnostic systems. Participation in EPTC offered valuable visibility for the project within the global electronics and packaging research community.
We thank imec for representing M3NIR at this important event and for contributing to the dissemination of our technological advancements on an international stage.
